Top researchers and dynamic graduate students from around the world

Our vision is to use our unique resources to perform world-class research in the field of micro/nanotechnology. This is consistent with our goal of designing practical micro/nanosystem solutions to common real-world problems.



Micro / Nanoelectromechanical Systems (MEMS/NEMS) provide the advantages of small size, low cost, low power consumption, low mass, high reliability, and low maintenance on both the system as well as the component levels. Our research interests are to develop and fabricate mechanical machines that are integrated with microelectronics at the micron scale. New device concepts include but are not limited to: the integration of micro-optics components, miniature signal processing devices, biomedical/genome processing devices, miniature electromechanical wireless components (filters, mixers, antennas), miniature opto-electromechanical devices (Optical Cross Connect, optical relays, optical multiplexers, deformable optics), miniature biosensors and environmental sensors, and microfluidics devices. Issues such as self-testing, self-assembly, and automated packaging will be explored.

Nanodevices: Biomedical Applications

On a smaller scale, the potential applications of Carbon Nanotubes (CNT) for biomedical instruments are limitless. CNT exhibit unique properties that include extremely high mechanical strength, high thermal conductivity, excellent chemical and thermal stability. Our lab's nanotechnology experience will assist in developing novel designs and fabricating concepts based on CNT/nanotechnology for next-generation instruments. The ultimate goal of the research is to realize fully functioning performance-enhanced biomedical nanodevices for clinical deployment.

Capacitive Micromachined Ultrasonic Transducers

Since the inception of the lab's CMUT team seven years ago, we have matured into one of the leaders in the field. Our research involves CMUT simulation, fabrication, system integration, and packaging. We have already developed several generations of CMUTs and customized imaging systems.

CMUT can be viewed as a parallel plate capacitor with a movable top plate. When a voltage pulse is applied across the plates, the top plate vibrates and launches an acoustic wave. Due to the unique properties of CMUTs, the bandwidth of an ultrasonic signal generated by a CMUT is much larger than piezoelectric transducers. Ultrasound’s larger bandwidth translates to its ability for a higher axial, or depth, resolution detection.

Part of our previous efforts were to simplify the CMUT fabrication process and reduce the fabrication cost. The CMUTs are created using a fusion wafer bonding technique with regular silicon wafers. As a result, high cost silicon-on-insulator (SOI) wafers, which are used extensively in most other CMUT fabrication processes, are avoided.

Currently, one of our main research objectives is to develop large high-density CMUT arrays for large-area real-time 3D imaging.